Smart factories

Intekplus wins chip-inspection order worth nearly half its 2025 revenue

bump-inspection systems use white-light 3D optics to measure tiny, closely spaced bumps on flip-chip substrates, fan-out panels and wafers.

Kbot Crew

Kbot Crew

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Intekplus iSIS-NBGA inspection machine, a white enclosed system with a tray loader and signal tower, used to inspect bumps on flip-chip substrates.
Intekplus's iSIS-NBGA bump-inspection system for flip-chip substrates. Photo: Intekplus

Intekplus (인텍플러스), a maker of machine-vision inspection equipment in Daejeon, South Korea, has signed a US$29.9 million contract to supply semiconductor and substrate inspection machines (substrates are the boards chips are mounted on inside a package) to an unnamed semiconductor-related company in Greater China. At 40.1 billion won, the order equals 44.6% of Intekplus's total revenue for 2025.

It is larger than the 30.9 billion won (about US$23 million) contract Intekplus filed on Oct. 12, which The Elec (디일렉) reported was its largest single supply contract disclosed in 2026. Intekplus has not carried out a similar contract with this buyer in the past three years, according to its Nov. 9 filing. The filing withholds the buyer's name until Jan. 15, 2028, at the buyer's request. It gives no delivery site.

Intekplus says its bump-inspection systems use white-light 3D optics to measure the height and diameter of the tiny, closely spaced bumps on flip-chip substrates, fan-out panels and wafers.

Even before the new order, The Elec counted eight contracts worth about 103.6 billion won (about US$77 million) disclosed in 2026 through Oct. 12, more than Intekplus's total revenue for 2025. By our count from that tally and the new filing, Intekplus has disclosed more than 140 billion won (more than US$100 million) of contracts in 2026.

Five of those eight went through sales agents in Taiwan and China, The Elec reported. It said equipment ordered through Intekplus's Taiwanese agent is expected to go to substrate maker Zhen Ding Technology of Taoyuan, Taiwan, and equipment ordered through its Chinese agent to plants that Austrian substrate maker AT&S runs in China. A June 26 filing for one such contract says the machines will be installed at AT&S.

AT&S said in May it would expand capacity at its site in Chongqing, China, as a key customer's demand for its high-end chip substrates grows with AI's need for computing power.

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Editor: Ian Lamont

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